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Careers

Careers

Careers
Talents Recruitment
Packaging Engineer
Hefei
Undergraduate
2

Descriptions:

1. Responsible for the development of related packaging process, including the evaluation of new materials and mass production introduction
2. Introduction of new process and improvement of yield
3. Establish and improve process specifications and standard processes
4. Continuous improvement to enhance product quality and output
5. Failure analysis and corresponding plan of related process

Qualifications:

1. Bachelor degree or above
2. 3 years of relevant industry experience, such as semiconductor, Led and LCD display industry
3. Familiar with relevant packaging process, and have some quality control experience of production line, strong sense of responsibility and good communication ability

Process Engineer
Hefei
Undergraduate
2

Descriptions:

1. Participate in technical discussion, propose solutions and evaluate its feasibility aimed at technology problems
2. Be able to independently formulate new process experimental plan, analyze experimental results and draw conclusions
3. Participate in equipment process parameter testing, abnormal analysis, yield improvement, etc.
4. Analyze and improve the abnormal process of the station to ensure the normal operation of the production line
5. Assist other departments to complete the process testing and verification of the station and put forward reasonable suggestions
6. Fully evaluate the project plan and promote the project progress
7. Evaluate,check and accept the machines of station
8. Assist in the query of yield and loss, and put forward improvement plans targeted on them

Qualifications:

1. Bachelor degree or above, relevant science and engineering majors, such as microelectronics, physics, materials, chemistry, electronics, etc.
2. Familiar with semiconductor process flow, such as coating film, etching, yellow light, cleaning, defect inspection, etc. , with background knowledge in semiconductor physics, process device or integrated circuit design, etc.
3. Familiar with process flow monitoring, process quality control, SPC control, process maintenance, document formulation, personnel training, etc.
4. Solid foundation on DOE principle knowledge, test design, test implementation and follow-up, result analysis, technology transfer and production introduction
5. Strong logical analysis and execution abilities
6. Able to work under high pressure and flexible response to emergencies

Red LED Epitaxy R&D Engineer
Hefei
Undergraduate
2

Descriptions:

1. Responsible for MOCVD quaternary compound, AlGaInP epitaxial product development, epitaxial material structure design, and epitaxial material quality analysis
2. Communicate with customers, offer engineering support and solve relevant technical problems
3. In charge of R & D project proposal, mass production and EOL planning
4. Assist in handling abnormal customer complaints of the Engineering Department

Qualifications:

1. Bachelor degree or above, optoelectronics, materials, microelectronics or relevant majors.
2. Solid semiconductor devices knowledge
3. Good communication and expression abilities, conscientious and responsible working attitude, and strong execution ability

Chip R&D Engineer
Shanghai
Undergraduate
2

Descriptions:

1. Responsible for new process, new structure and new product development of RGB MicroLED micro display chip
2. In charge of new product introduction, process improvement and product yield improvement of RGB MicroLED micro display chip
3. SOP formulation, examination and verification of each process station for new products
4. Assist the PM to complete the training of process engineers and guide the work of process engineers

Qualifications:

1. Bachelor degree or above, major in materials, semiconductor, optoelectronics, physics, etc.
2. Good semiconductor device knowledge background, and Led process development experience is preferred
3. Have strong logic analysis ability and data sensitivity, and master photoelectric performance test of semiconductor device, semiconductor material and device failure analysis
4. Good communication and expression abilities, conscientious and responsible working attitude, and strong execution ability

Digital IC Design Engineer
Shanghai
Undergraduate
2

Descriptions:

1. Proficient in using Verilog / SystemVerilog to achieve IP and ASIC level design and verification
2. Establish or optimize the design and verification flow based on Perl, python, TCL or other shell scripts
3. Assist or be able to do verification with SystemVerilog and UVM
4. Complete gate-level synthesis
5. Complete formal verification from front-end to back-end
6. Assist the back-end engineer to complete timing closure
7. Complete FPGA prototype implementation and verification, and assist in FPGA testing
8. Write datasheet, design and testing procedure documents, and participate in engineering sample testing
9. Support in handling customer complaints and provide guidance

Qualifications:

1. Bachelor degree or above, more than 3 years of relevant experience, and have a deep understanding in digital logic design
2. Be familiar with Verilog design language and be able to make high-quality design based on the predicted synthesis results
3. Proficient in using SystemVerilog for verification
4. Master general protocols, such as SPI, I2C, APB / AHB bus, etc.
5. Experience in MIPI DPHY DSI interface design is preferred

Analog IC Design Engineer
Shanghai
Undergraduate
2

Descriptions:

1. Define product specifications and design architecture according to product requirements
2. Be responsible for circuit design and simulation verification
3. Assist layout design engineer to complete layout design
4. Layout parasitic parameter extraction and post simulation verification
5. Write design reports and testing documents
6. Be responsible for chip debugging and testing

Qualifications:

1. Bachelor degree or above, 2 years of Analog IC design experience or above
2. Solid analog circuit foundation, proficient in basic module design, such as OPA, Bandgap, etc.
3. Master circuit design, circuit simulation, physical verification and other tools
4. Be familiar with system modeling and other auxiliary design tools
5. LVDS, MIPI, LDO, DCDC, ADC, DAC experiences is preferred
6. Excellent working attitude and learning ability
7. Good reading and writing skills in English